Assembling sub-parts

A device often consists of several sub assembly parts, which have to be joined together. These parts are
processed/manufactured by our own facility or are supplied by an internal or external supplier.
Specific techniques that are available to make a device are: glueing, ACF bonding, wire bonding, powder blasting, laser cutting, lithography, etching etc.

In the past most devices were developed and made for display applications. Nowadays Device Processing  is also involved in making devices for e.g. lighting and biochemical applications.

For biochemical applications micro fluidic devices are realized with different levels of integration of specific
functions.
An example is the magnetic biosensor cartridge. The cartridge consist of a chip, flex foil, fluidic part and a
MID (moulded interconnection device). The chip is processed in Miplaza’s Thin Film Processing.
At Device Processing all techniques are available to assemble this cartridge. A pilot assembly line is set up to assemble small series of these cartridges.


Magnetic biosensor

Also in the area of lighting, especially the application of inorganic LEDs as light sources leads to many innovative device concepts that are being realized. Use is being made of light guides, a variety of incoupling and outcoupling structures, collimators, optical filters, diffusors, cooling elements etc. The aim is to develop concepts that are functional from an optical perspective, that will be manufacturable, that are thermally sound and have low cost.


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