Electroplating is a deposition method for a metal layer in which a galvanic cell is used.
| At TFF we use a nickel/iron bath in which the anode is a nickel plate. During processing this anode dissolves in the electrolyte (for the deposition of nickel-iron this solution also contains Fe2+ ions). |
| The substrate is placed in the cell as a cathode. When current is allowed to flow through the cell, a nickel (or nickel-iron) layer is deposited on the cathode. Typical thickness is 1 micron.In most cases a (sputtered) platingbase is necessary on the substrate for optimal electrochemical deposition. |
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| Layer guality and thickness can be measured with a Fischerscope X-ray system. |
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