For depositing a thin film coating a range of technologies is available. A great variety of metals, alloys and inorganic components can be grown. We have over 150 materials on stock. 

Lithography is used for patterning the thin film into a micro or nanostructure. The typical process sequence here is applying a resist film by spin coating, exposure of the resist, development of the resist and stripping of the resist.

The main task of etching is the removal of material from a substrate at selected locations up to a specified depth, while leaving the remainder of the substrate unchanged.

For controlling the thin films and patterns a great variety of measuring techniques is available.