WAG cleanroom

  1. Wet processing
  2. Measuring & Inspection
  3. SEM
  4. Implanter
  5. E-beam
  6. Furnaces
  7. Deposition + plasma etching
  8. Lithography

  • 2650 m2 of cleanroom area

  • deposition area - class 10000

  • lithography area - class 1000

  • laminair flow benches and e-beam - class 100


Process equipment

Sputtering (12 systems) metals, dielectrics, optical coatings
Evaporation (3 systems) metals, dielectrics, optical coatings
PE-CVD (4 systems) a-Si, SiN,SiO
LP-CVD (4 furnaces) poly-Si, SiN,TEOS
Furnaces (8 systems) annealing, diffusion, oxidation
Lithography contactaligners (4), i-line stepper, e-beam
single-wafer spinners (10), wafer tracks (2)
Plasma etching ion-beam etching, reactive ion etching, deep Si etching
Wet processing 70 laminair flow benches
Ion implantation high-voltage implanter, high-current implanter
Measuring profilometer, ellipsometer,4-point proe, etc.
Inspection microscopes, SEM (2 systems)
Chemical Mechanical Processing  
CAD mask design  
PCM testing  

 

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