Veeco I Nexus 800 Clustertool

The Veeco Nexus 800 is a multi functional system used to deposit metals or insulators on a variety of substrates.
The system has 6 process chambers available for deposition. These Chambers have all their own high-vacuum pump combined with a water pump. De targets are not facing each other. Therefore there is no cross contamination. 
The target dimension is 304 mm round. The tool is capable of uniformly (less than 3% non uniformity) deposit a substrate to max 200 mm round or 150mm square.

The system has two separate load locks with cassettes. In the cassette a maximum of 9 substrates can be loaded. The load lock is pumped to a base pressure of <5e-07 Torr. After reaching the transfer setpoint the substrate is transported via the dealer witch is at a pressure of < 5.0E-08 to the requested deposition chamber (s). 

All recipes used are maintained by the system owner.

 


Front view CVC


Process chamber

 

Targetpositions / options: 
Standard configuration

Proces module 1 

Al / Al2o3, AlCu1, AlTi2  
ITO cold deposition, 
hot processing for 6" square 
Dc, Pulsed Dc, Rf Bias possible

Proces module 2 

Ti / TiN 
TiW / TiWN 
Sputter etch 
Dc, Pulsed Dc, Rf Bias possible

Proces module 3 

Mo / MoO2 / MoN
Dc, Pulsed Dc, Rf Bias

 Proces module 4

AU, Dc magnetron
Dc, Pulsed Dc, 
Si / SiO2 
Dc, Pulsed Dc

Proces module 5 

Cr, CrN, CrO2, Cr2O3
Phase change Materials 
Ta / TaN / TaC / Ta2C Ta2O5 
Sputter etch 
Dc, Pulsed Dc, Rf Bias possible

Proces module 6

Pt 
Dc, Pulsed Dc, Rf Bias 

 
Substrate Dimensions
The following substrates (ceramic, glass, plastics, Si, ) are possible : 

1-200mm round 
1 t0 150mm square 
Substrate height max 9.0 mm 
max weight 350 gr.

Deposition Options
Dc Magnetron ,Max power 10 kW 
Pulsed DC 
Rf 
Bias Deposition

Sputteretch

in PM 2 en pm 5 is a shutter installed, The target is protected during the etch process and causes no additional contamination.

Substrate Heating

In PM1 is it possible to heat the substrate to 400°C with advanced backside heating. For each type of substrate a special carrier plate is needed.

 

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