PROFIT
|
B. Courtois
Technical Conference & Exhibition
8-13 July, 2001 Kauai, Hawaii, USA
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project
Last modified: 26 Nov 2002
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| Date: May 2000 | |
| Author: John Parry, Chris Bailey, Chris Aldham | |
| Title: Multiphysics Modelling for Electronic Design | |
| Event: ITHERM 2000 | |
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| Abstract: | |
| Full Paper: link | |
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| Date: June 2000 | |
| Author: Xavier Le Goaer, Salvador Mir | |
| Title: Conception d'une puce dédiée au test thermique de boîtiers électroniques (self-calibrating thermal test die) | |
| Event: Master's thesis | |
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| Full Paper: link | |
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| Date: September 2000 | |
| Author: Clemens Lasance | |
| Title: Two Benchmarks for the Study of Compact Thermal Modelling Phenomena | |
| Event: THERMINIC 2000 | |
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| Abstract: | |
| Full Paper: link | |
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| Date: December 2000 | |
| Author: Clemens Lasance | |
| Title: The European Project PROFIT: Prediction of Temperature Gradients Influencing the Quality of Electronic Products | |
| Event: SEMITHERM 2001 | |
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| Full Paper: link | |
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| Date: December 2000 | |
| Author: Clemens Lasance | |
| Title: The Conceivable Accuracy of Experimental and Numerical Thermal Analyses of Electronic Systems | |
| Event: SEMITHERM 2001 | |
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| Abstract: | |
| Full Paper: link | |
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| Date: December 2000 | |
| Author:
A Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Szekely,
K. Torki, S. Mir, B. Courtois |
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| Title: Design Issues of a Multi-Functional Intelligent Thermal Test Die | |
| Event: SEMITHERM 2001 | |
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| Abstract: | |
| Full Paper: link | |
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| Date: April 2001 | |
| Author: M. Rencz, V. Szekely, A. Poppe, B. Courtois | |
| Title: New tools and methods for the thermal transient testing of packages | |
| Event: | |
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| Abstract: link | |
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| Date: April 2001 | |
| Author: M. Rencz, V. Szekely | |
| Title: A generic method for thermal multiport model generation of IC packages | |
| Event: | |
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| Abstract: | |
| Full Paper: link | |
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| Date: April 2001 | |
| Author: M. Rencz, V. Szekely, S. Torok, S. Ress | |
| Title: Calculating effective board thermal parameters from transient measurements | |
| Event: | |
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| Full Paper: link | |
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| Date: May 2001 | |
| Author: M. Warner, J. Parry, C. Bailey, C. Marooney, H. Reeves, K. Pericleous | |
| Title: Flo/Stress: An integrated stress solver for the CFD tool Flotherm | |
| Event: The
Pacific Rim/ASME International Electronic Packaging Technical Conference & Exhibition 8-13 July, 2001 Kauai, Hawaii, USA |
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| Abstract: | |
| Full Paper: link | |
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| Date: November 2002 | |
| Author: John Parry, Jukka Rantala, Clemens J.M. Lasance. | |
| Title: Enhanced Electronic System Reliability | |
| Event: Proceedings of 7th THERMINIC Workshop, Paris France | |
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| Abstract: | |
| Full Paper: Link | |
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| Date November 2002 | |
| Author: J. Parry, C. Marooney, M. Warner, C. Bailey and K. Pericleous | |
| Title: An Integrated Approach to Flow, Thermal and Mechanical Modeling of Electronics Devices. | |
| Event: May 29 - June 1 2002, San Diego CA | |
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| Full Paper: Link | |
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| Date November 2002 | |
| Author: John Parry, Heinz Pape, Dirk Schweitzer and John Janssen | |
| Title: Transient Performance of Common Modeling Assumptions Used in Detailed Thermal Package Models. | |
| Event: Proceedings of 8th THERMINIC Workshop, Madrid Spain | |
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| Abstract: | |
| Full Paper: Link | |
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