12529 PROFIT:
Prediction of Temperature Gradients Influencing the Quality  of Electronic Products

Abstract:

Many business objectives related to yield, performance, reliability or safety are functions of temperature (gradients). PROFIT aims to create methods and tools to enable a timely assessment of these objectives in all stages of the product creation process. Today"s analyses are seriously hampered by the lack of methods to predict temperature gradients in time and space at package, board and system level with sufficient accuracy. The project aims to overcome these drawbacks by major improvements in experimental techniques to acquire input data, in non-linear parameter estimation methods and in transient thermal characterisation of components. Standardisation is considered an important deliverable. Ultimately, the results are suited for implementation in emerging virtual prototyping methods and physic-based reliability analysis software.

Objective:

The main objective of PROFIT is to provide the designers responsible for yield improvement, performance, reliability and safety with reliable and accurate temperature-related information. The availability of accurate experimental and numerical techniques for the determination of temperature and temperature gradients in time and space is the main deliverable. Its feasibility will be proven in a set of demonstrators, covering major improvements in experimental and numerical analysis of the whole electronic design chain from device to system. Demonstrators will be delivered in a stepwise approach in order to measure intermediate results and to control progress and risks.

Safety, performance and reliability of electronic products are a function of temperature. Higher accuracy in temperature predictability gives better control of design and manufacturing. Higher-quality products have a positive impact on the product’s life-cycle-cost and people’s quality of life.

Industrial problems:

1. Cost/weight reduction with better quality.
2. Physics-based prediction of reliability
3. Yield improvement of packages
4. Awareness of problems due to the absence of useful design specs    
5. Standardisation of thermal characterisation.

Solutions offered by PROFIT:

• Significant improvements in temperature prediction for virtual prototyping
• Accurate predictability of temperature gradients in time and space
• Better-defined rejection criteria based on in-line quality testing

• Dissemination of combined thermal expertise in EU through international contacts.

Description of work:

The work will be directed towards major improvements in thermal analysis of the whole electronic design chain, from device via package and board to system. Important data required for accurate numerical analysis are lacking: interface resistances, emissivities, local boundary conditions and local board thermal conductivities, for which test setups will be built based on transient temperature measurements. Transient measurements at device and package level will be performed to assess their quality. Analysis of the data will be treated by using novel non-linear parameter estimation methods. Software will be improved, developed and integrated to facilitate the application of the project results in performance and reliability calculations. Various demonstrators showing the final deliverables are foreseen. The EU lead in thermal characterisation of steady-state compact models will be extended to the transient domain. Yearly workshops will be organised to promote discussion amongst experts, and to facilitate early standardisation.

In short, the innovative elements are:

• Novel statistical approach for the optimisation of experiments, analysis of transient data and generation of compact models.
• Novel measurement techniques for the acquisition of input data.
• Novel electrothermal and thermomechanical board/system level software.
• New proposals for the standardisation of transient thermal characterisation.

The Workpackages show clearly the required elements of the design chain: device, package, board, system.

Expected results:

The main project deliverable is the availability of accurate experimental and numerical techniques for the determination of temperature and temperature gradients in time and space. Its feasibility will be proven in a set of demonstrators, covering major improvements in experimental and numerical analysis of the whole electronic design chain from device to system. Demonstrators will be delivered in a stepwise approach in order to measure intermediate results and to control progress and risks.

The Consortium:

The consortium combines strong technological capabilities with major scientific and business knowledge in all areas required to make the project a success:

• pragmatic system level thermal analysis (Philips Research, Nokia),
• state-of-the-art numerical thermal simulation (Flomerics, MicRed, TUB),
• major expertise in statistical techniques (CQM),
• sophisticated measurement techniques (TUB, MicRed, Philips Research),
• top-level test die fabrication (TIMA),
• high-level knowledge on standardisation of thermal characterisation (Philips Research, Philips Semiconductors, Infineon, STMicroelectronics),
• large experience in European thermal dissemination activities (TIMA),
• a business interest in the engineering software that guarantees transfer of knowledge to industrial designers (Flomerics, MicRed, CQM), and
• business interests in the final project results (Nokia, Philips Electronics).

Planning: